The 4th IEEE International Conference on High Performance and Smart Computing
(IEEE HPSC 2018)
May 3rd-5th, 2018, Omaha, NE, USA.


Committees and Conference Organizations

General Chair
Sun-Yuan Kung, Princeton University, USA
Meikang Qiu, Pace University, USA
Bhavani Thuraisingham, The University of Texas at Dallas, USA
Honored General Chair
Xiaodong Wang, Columbia University, USA
Program Chairs
Shui Yu, Deakin University, Australia
Yongxin Zhu, Shanghai Jiaotong University, China
Keke Gai, Beijing Institute of Technology, China
Industry Chair
Mehdi Javanmard, Rutgers University, USA
Peng Zhang, SUNY Stony Brook, USA
Operation Chair
William Voorsluys, University of Melbourne, Australia
Keke Gai, Beijing Institute of Technology, China
Publicity Chair
Yu Huang, Peking University, China
Ngoc Tu Nguyen, Missouri University of Science and Technology, USA
Younghee Park, San Jose State University, USA
Yuanchao Shu, Microsoft Research Asia, China
Zhoujun Li, Beihang University, China
Local Chair
Sheng Wei, University of Nebraska - Lincoln, USA
Qiben Yan, University of Nebraska - Lincoln, USA
Technical Program Committee
Xiaolin wang, Peking University, China
Donggang Cao, Peking University, China
Jian Zhang, Institute of Software, Chinese Academy of Sciences, China
Shui Yu, Deakin University, Australia
Hiroyuki Sato, The University of Tokyo, Japan
Gang Qu, University of Maryland, USA
Hao Chen, Shanghai Tech University, China
Wei Zhang, Southern Illinois University, USA
Shuai Ma, BeiHang, China
Gang Xie, Taiyuan University of Technology, China
Zhihui Du, Tsinghua University, China
Jian Yin, Pacific Northwest National Laboratory, USA
Wen-Ping Lai, Yuan Ze University
Zhipeng Wang, China Electronics Standardization Institute, China
Jiang Xu, Hong Kong Universtiy of Science and Technology, China
Tao Zhang, Northwest Polytechnical University, China
Yunchuan Sun, Beijing Normal University, China
Wei Song, Nanjing University of Science and Technology, China
Pengcheng Zhang, Hohai University, China
Wei Yu, Towson University, USA
Zhiqiang Lin, University of Texas at Dallas, USA
Chiu Tan, Temple University, USA
Bo Luo, The University of Kansas, USA
Xin Li, Carnegie Mellon University, USA
Hai Jiang, Arkansas State University, USA
Zhipeng Wang, China Electronics Standardization Institute, China
Xingfu Wu, Texas A&M University, USA
Wenbo Zhu, Google Inc. USA
Hwajung Lee, Radford University, USA
Dean Anderso, Bank of America Merrill Lynch, USA
Yong Guan, Iowa State University, USA
Chao-Tung Yang, Tunghai University
Hao Hu, Nanjing University, China
Lei Ju, Shandong University, China
Yunchuan Sun, Beijing Normal University, China
Yan Zhang, University of Oslo, Norway
Haibo Zhang, University of Otago, New Zealand
Hiroyuki Sato, The University of Tokyo, Japan
Hao Chen, Shanghai Tech University, China
Yangbin Tang, National Defense University of China, China 
Jian Mao, BeiHang, China
Jiahai Yang, Tsinghua Univesity, China
Fuji Ren, The University of Tokushima, Japan
Long Fei, Google Inc. USA
Xiaofu He, Columbia University Medical Center, USA
Ukka Riekki, University of Oulu, Finland
Jun Wu, National Pingtung University, China


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